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Technical Specification for Wooden Backup Board
Application:
Circuit
Board Drilling, Flexible Circuit
Board, Double Sides, Surface Mount,
Back-Plane, High Density Interconnect
MLB.
Thickness:
2.50mm ( MDF )
| Properties |
ASTM |
Unit |
Value |
| Thickness |
- |
mm |
2.5 < t < 4 |
| Density |
- |
kg/m3 |
830 |
| Density Tolerance |
- |
kg/m3 |
20 |
| Moisture Content |
- |
% |
7 + 2 |
| Thickness Tolerance |
- |
mm |
0.15 |
| Single Board Thickness
Tolerance |
- |
mm |
0.15 |
| Modulus of Rupture |
- |
N/mm2 |
> 35 |
| Modulus Elasticity |
- |
N/mm2 |
> 3000 |
| Wet modulus of Rupture |
- |
N/mm2 |
> 10 |
| Internal Bond |
- |
N/mm2 |
> 1.0 |
| Screwholding |
Face |
N |
- |
| ( thickness > 15mm ) |
Edge |
N |
- |
| Thickness Swelling |
(20°C, 24 hours) |
% |
< 17 |
| Absorption by Mass |
(20°C, 24 hours) |
% |
< 45 |
| Dimensional Stability 20°C |
|
|
|
| ( 35% RH & 85% RH ) |
Length/Width |
% |
< 0.50 |
| Surface Absorption |
- |
mm |
> 150 |
| Surface Soundness |
- |
N/mm2 |
> 1.2 |
| Sand Content |
- |
% |
< 0.05 |
| Formaldehyde Emission |
(EMB) Class B |
(mg/100g) |
< 30 |
| Formaldehyde Emission |
(JIS) |
(mg/I) |
< 5 |
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